The DSN SK30 series is a superior thermal conductive pad.It is in low thermal resistance performance at low pressure.It has nature inherent tack,without needing extra glue tape that would impede the thermal conductive properties.
DSN SK30R is a high strength, high elasticity, high insulation, flame retardant,cost-effective of thermal interface material, for different applications, developed a number of models, which can meet the high compression and many heavy industries, tearing,high-frequency vibration impact and a wide variety of applications, especially suitable for automotive power battery pack.
DSN SK30FG is a model of thermal conductive pad adopted with strengthened fiberglass based compound material, performing as higher tear resistance and puncture resistance, it also improves operability.
Product Description
Thermal conductivity: 3.0W/mK
Low thermal resistance at very lowpressures
High electrically isolative
Superior Temperature endurance
Conformable,lowhardness
Double side self-tacky
PC/NB
VGA
Network communication equipment
LCD back-lightmodule
H.D.D&DVD
DRAM modules
High thermal conductivity module
Automobile engine control unit