Security system belongs to the category of electronic industry. It is the comprehensive utilization of modern computer technology, integrated circuit application technology, network control and transmission technology and software technology. Security products can be roughly divided into three categories: video surveillance, access control and anti-theft alarm. From "visible" to "visible", and then to today's intelligence, the initiative of the security industry has been continuously enhanced. Edge perception + intelligence have gradually become a new goal of the intelligent security industry. The era of highly intelligent comprehensive security has come.  


Intelligent security puts forward higher requirements for image transmission speed, definition, and video storage time and data analysis. This combination not only increases the cost of video surveillance storage scheme, but also increases the heat flux and calorific value of its circuit system, which brings great pressure on the manageability of the overall intelligent security solution. As we all know, the working temperature of electronic devices directly determines its service life and stability. Heat dissipation has become an important index to measure product performance in the electronic industry, especially the heat dissipation of surveillance cameras. In practical application, if the core chip temperature is too high due to poor heat dissipation, it is easy to cause a series of thermal fault problems such as fuzzy monitoring picture, packet loss, bit error and restart.


The camera is gradually moving towards the high-end such as 1080p, 4K and 8K image quality, high-definition pixels, and advanced technologies such as high-definition image processing and big data computing make the problems of thermal management and EMI shielding increasingly prominent. High power consumption and heat generation and closed environment put forward higher requirements for the overall heat dissipation scheme. The volatilization of heat conducting material molecules, silicon oil precipitation and silicon migration have an important impact on the optical lens; the low temperature resistance of the chip has become the bottleneck of heat dissipation. How to reduce the interface thermal resistance is an important factor to be considered in thermal design.


In order to ensure the stable and reliable operation of the camera, it is urgent to reduce the working thermal load of the core components and alleviate the thermal stress concentration of the circuit board. Dasen electronic's high-performance interface materials (thermal grease, thermal pad, thermal tape, etc.) with low volatility, high thermal conductivity, low oil permeability and ultra softness have been tested at high temperature, providing professional thermal management solutions for the security industry to ensure the safety of normal operation and long-term reliability of security products.