16 kinds of heat dissipation methods for semiconductor and the importance of thermal design for electronic equipment

16 kinds of heat dissipation methods for semiconductor and the importance of thermal design for electronic equipment

Common materials for electromagnetic shielding:
1、 Conductive elastomer lining (conductive rubber)
2、 EMI conductive foam lining
3、 Metal EMI lining, clip lining and hook claw material beryllium copper spring
4、 Conductive composite
5、 Absorbing materials

Design services and quality assurance of heat sink, vapor chamber, heat pipe and radiator - Dasen

Nowadays, there are more and more kinds of electronic products around us. When we choose, we will not only compare their functions, but also consider the appearance. The current development trend of electronic products is thin and light weight. Therefore, there will be a challenge, that is, the internal space of electronic products is becoming more

The square cell of the electric vehicles can be inserted into these small spaces like a computer hard disk. The side of each cell is also pasted with thermal conductive silicone pad, and the heat sink along the width direction of the cell has a heat dissipation channel, which can be directly connected with the external cooling pipeline.

Brief introduction of thermal conductive gel. Characteristics and application of thermal conductive gel

Several thermal conductive interface materials for high power LED schemes: 1. Thermal conductive silicone grease 2. Thermal conductive silica gel pad 3. Heat conduction double-sided adhesive

Thermal conductive silica gel pad is an indispensable part of thermal interface materials. At the same time, the thermal pad is also divided into two forms: with or without adhesive. When we choose to use this material, which one is better?

This paper takes the internal heat treatment of mobile phone as an example to explain the application of graphite foil in the smart phone

Thermal silica gel pad is a kind of thermal interface material which will not cause short circuit. It is mainly composed of silica gel and metal oxide. The thermal conductive silicon pad on the market has a wide range of applications, which can be used in communication, electronics, medical and other industries. The market demand for this kind of b

VC (Vamper Chamber) used for NOTEBOOK has an increasing trend. The radiator pointed out that the vapor chamber has been continuously improved in recent years, and some brands such as HP and Lenovo will introduce super-large vapor chambers in the second half of the year, and remove active cooling devices such as fans, so as to further meet the dual

DSN is using NETZSCH LFA447 thermal conductivity meter to test the horizontal thermal conductivity of graphite sheet.

In addition to high voltage resistance, low hardness and good softness, the thermal conductive silicon pad of power battery should also have ultra-high fire resistance and whether it is alumina free abrasive.