Ultra-thin vapor chamber is recommended for cooling 5G mobile phone
[ Date: 2020-08-10 10:45:37 Author: Popularity: ]
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With the development of 5G communication network, 5G smart phones are developing in the direction of thinness, intelligence and multi-function. The high integration of equipment puts forward higher performance requirements and challenges for the heat dissipation processing technology of mobile phone materials.

Mobile phone cooling scheme is from the border heat dissipation, heat conduction gel to heat pipe, and then to the vapor chamber and so on. In the current 5G mobile phone's different heat dissipation solutions, as a new way to solve the cooling problem of mobile phone in the future, the vapor chamber has gradually become the main product in the 5G commercial era. Ultra-thin vapor chamber has strong heat conduction capacity and can be flexibly designed according to the requirements. The following are the main parameters of ultra-thin vapor chamber:



Ultra-thin vapor chamber

Test method







Working temperature


IEC 60068-2-14

Temperature difference


HFC test standard



HFC test standard

Thermal conductivity


HFC test standard


The ultra-thin vapor chamber is a closed vacuum cavity with microstructure on the inner wall. When the heat flow is transferred from the heat source to the evaporation area, the working fluid in the cavity will start to vaporize at a specific temperature due to the vacuum condition. At this time, the working fluid will absorb heat energy and evaporate rapidly. Under this condition, the vapor phase will fill the whole cavity. The thermal conductivity doesn't change with direction. Its thermal conductivity is as high as 5000W/mK, which can rapidly reduce the working temperature of 5G mobile phone core devices. At the same time, there is no power transfer in the heat conduction process, so it is efficient and energy-saving. Vapor chamber can effectively solve the heat conduction and diffusion problems of high-density integrated, heat concentrated and space limited products, prolong the service life of products, and reduce the design space of products, so that the products are thinner and smaller.