Heat dissipation methods and heat conducting materials for household induction cooker components
[ Date: 2022-06-15 16:50:06 Author: Popularity: ]
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With the rapid development of science and technology, the traditional gas stove that needs to be heated by open fire is no longer needed. In order to pursue a higher quality of life, people have adopted the electromagnetic stove that has the characteristics of no open fire, no exhaust gas emission, no noise and greatly reducing the greenhouse effect, which has greatly improved the kitchen environment. As a high-power electric heating device, most parts of the induction cooker are electronic components, which itself has a heating problem. Therefore, the requirements for the internal temperature of the work are quite strict. If the heat dissipation is poor, the product will have a high failure rate and poor stability. The problem of heat dissipation has become a major difficulty that hinders the development of the induction cooker industry of household appliances. Because the induction cooker uses the principle of electromagnetic induction to realize heating, it uses alternating current to generate alternating magnetic field with changing direction through the coil, and vortex current will be generated inside the conductor in the alternating magnetic field, which is caused by the carrier movement in the conductor driven by the vortex electric field. The Joule effect of vortex current will make the conductor temperature rise, thus realizing heating.


The heat dissipation structure of a household induction cooker includes an induction cooker shell, a circuit board and a coil disc, a heat dissipation fan, and heating components; The bottom or side of the base is provided with an air inlet and an air outlet, the circuit board and the coil disc are assembled and fixed on the base, and at least one fan is assembled and fixed on the base between the circuit board and the coil disc. After the external air enters from the air inlet, the air flow first passes through and cools the circuit board, then blows to the coil disc through the fan, and then flows out from the air outlet. Through reasonable component layout design, the air flow loss is effectively reduced. At least one fan is set between the circuit board and the coil disk on the air flow path, so that after the external air enters from the air inlet, the air flow first passes through and cools the heat source components on the circuit board, then the air flow is blown to the coil disk through the fan, and then flows out from the air outlet. The internal flow field is uniform and the air flow loss is small. It is easy to control the flow field to pass through the heat source effectively, so as to improve the heat dissipation efficiency, get more ideal overall heat dissipation effect.


Disassembly drawing of induction cooker


 There are two ways of heat dissipation for household induction cooker: air cooling and water cooling, and the structure of air cooling + radiator is usually adopted. Components such as IGBT and bridge stack are high-power devices, which will generate a lot of heat when working. In order to better solve the internal heat dissipation problem of the induction cooker, it is required to improve the heat exchange efficiency of the induction cooker as much as possible in a limited space and reduce the heat transfer resistance of the contact surface. In addition to optimizing the heat dissipation structure design, it also needs high heat conduction materials with higher heat conduction and lower heat resistance, so that the heat of the heat source can be transferred to the heat dissipation shell more quickly.


Thermal management materials can well solve the reliability and electromagnetic compatibility problems of heating components such as circuit board and coil disc of induction cooker in complex environment. In view of the high thermal conductivity demand of induction cooker for thermal conductive materials, the material mainly recommended by Dasen is thermal conductive silica gel pad to solve the heat dissipation solution.


Thermal conductive silica gel pad characteristics:

1.Good thermal conductivity

2.Geothermal impedance

3.With self-adhesive without additional surface adhesive

4.Highly compressible, soft and elastic, suitable for low pressure applications

5.Available in various thicknesses

6.Comply with UL94V0 fire rating