Products

Ultra thin thermal fabric

The surface of thermal silica pad is flat and smooth. It has good adhesion to the surface metal and ceramic base materials. With high thermal conductivity, it can achieve low thermal resistance under relatively low pressure.

Characteristic
High thermal conductivity, low thermal resistance
High AC voltage value
Smooth surface
Strong pressure resistance, wear resistance
Non-sticky surface

Product Description

 

Typical Applications Include:

• Power supplies

• Automotive electronics

• Motor controls

• Power semiconductors

 

PROPERTIES UNITS TF15 TF18 TF35 TEST METHOD
Color / Dark red Dark red White Visual
Thermal impedance 1mm@20psi ℃in2/W 0.7 0.61 0.23 ASTM D5470
Specific gravity g/cm3 2.5 2.5 2.47 ASTM D792
Volume resistivity ΩCM 1012Ω 1012Ω 1013Ω ASTM D257
Thermal conductivity W/mk 1.5 1.8 3.5 ASTM D5470
Withstand voltage KV@1mm 6 6 6 ASTM D149
Thickness (±10%) mm 0.15~10 0.15~10 0.5~10 ASTM D374
Hardness Shore 00 80 90 90 ASTM D2240
Flammability class UL94-V@2mm UL94-VO UL94-VO UL94-VO UL94
Working temperature -40~+200 -40~+200 -40~+110 ***
Tape choose / ***
Self-adhesive / -- -- -- ***
Fiber strengthen / ***