Views: 0 Author: Site Editor Publish Time: 2020-04-17 Origin: Site
With the development of 5G communication network, 5G smart phones are developing in the direction of thinness, intelligence and multi-function. The high integration of devices puts forward higher performance requirements and challenges to the heat treatment technology of mobile phone materials.
Mobile phone cooling scheme is from the border heat dissipation, thermal gel heat dissipation to heat pipe heat, and then to the heat dissipation plate and so on. Among the different heat dissipation schemes of 5G mobile phone, the vapor chamber (VC) as a new way to solve the heat dissipation problem of mobile phone in the future, has gradually become the main product of 5G commercial era. DSN has launched ultra-thin VC for mobile phone applications, which has strong heat conduction ability and can be designed flexibly according to the demand. The following are the main parameters of ultra-thin VC:
| Ultra-thin VC | Test method |
Thickness | 0.35-0.5mm | ASTM D 374 |
Color | Copper natural color | Visual inspection |
Service temperature | -40~100℃ | IEC 60068-2-14 |
Temperature difference | ＜5℃ | HFC test standard |
Tcase | ＜90℃ | HFC test standard |
Thermal conductivity | ＞5000W/MK | HFC test standard |
Ultra-thin Vapor chamber is a closed vacuum chamber with micro structure on the inner wall. When the heat flow is transmitted from the heat source to the evaporation area, the working fluid in the chamber will start to vaporize at a specific temperature due to the vacuum condition. At this time, the working fluid will absorb the heat energy and evaporate rapidly. The vaporized vapor will fill the entire cavity under this condition, and its thermal conductivity will not change with the direction. Its thermal conductivity is over 5000, which can rapidly reduce the working temperature of 5G mobile phone core devices, and there is no power transmission in the process of heat conduction, which is efficient and energy-saving. Ultra-thin VC can effectively solve the heat conduction and diffusion problems of high-density integration, heat concentration and space limited products, extend the service life of the products, reduce the design space of the products, and make the products lighter, thinner and more miniaturized. The following is the picture of ultra-thin VC.
In conclusion, the ultra-thin Vapor chamber has the advantages of flexible design, ultra-thin, good thermal conductivity, safety and reliability, and is an excellent solution for heat management of 5G mobile phone and other large and small electronic equipment.