5G and Gigabit Internet belong to faster networks, but they need the highest performing thermal interface material (TIM) to maximize their performance. Graphite sheet is a better choice to meet the requirement.

Taking the urgent demand for thermal design of data processor as an example, the full path high-efficiency heat conduction method based on pyrolytic graphite sheet can reduce the temperature of digital signal processor (DSP) chip by pasting graphite sheet on the computing module frame with concentrated heat source.

The development of power electronic products in the industrial and consumer fields is very fast. Compared with traditional thermal interface materials (TIM), flexible graphite sheet can provide reliable performance under various conditions and temperatures. It can be die cut to all modules, including WBG devices, inverters and IGBTs.