​Thermal graphite sheet has been widely used in 3C eletrocnics such as mobile phones. In battery modules, the large surfaces of the battery cells can be used for insulation (to prevent thermal runaway and spread), compression (to prevent excessive expansion of the battery cells), and of course, graphite sheets can also be added for heat dissipation and temperature equalization.

SSD flash memory wears out over time when exposed to high temperatures. This wear leads to electron leakage and recognition errors. When an SSD overheats, its controller may malfunction, resulting in various unstable disk behaviors. For instance, your SSD may not be recognized by Windows, your compu

From continuously trained algorithm models to real-time responsive intelligent decision-making, thermal conductive graphite sheets, with their stable heat dissipation capability, lay a solid "cool" foundation for machine learning devices. They enable more sustained computing power output and more thorough performance, emerging as a key enabler for driving intelligent iteration.

Thermal conductivity graphite sheet related parameters: Thin film polymer compounds can undergo chemical graphitization treatment under high temperature and high pressure, because carbon is a non-metallic element, but it has the electrical and thermal properties of metallic materials. It also has the same plasticity as organic plastics, and has special thermal properties, chemical stability, lubricity, and the ability to coat solid surfaces, as well as some good processability. Therefore, heat dissipating graphite materials has been widely used in many fields such as electronics, communication, lighting, etc. Thermal conductive graphite materials provide a unique combination of high performance and unique solutions for the thermal management industry.

Graphite thermal conductive foil, which has high thermal conductivity and flexibility, effectively adheres to the internal structure of glasses to achieve rapid heat dissipation of chips. Integrating graphite heat dissipation foil layer, utilizing its ultra-high thermal conductivity to dissipate SoC