The heat dissipation materials used in flash storage devices include aluminum heat sinks, graphite heat dissipation sheet, thermal conductive silicone grease and high thermal conductivity silicone thermal pad. These heat dissipation materials each have their own characteristics and are suitable for different types of flash storage devices. They improve the heat dissipation performance of the devices in different ways, ensuring stable operation even in high temperature environments.

3M tape is a high-performance tape widely used in multiple fields. According to customized requirements, DASEN can offer die-cut 3M tape. It has a wide range of applications, such as: 1. Electronics industry: used for bonding electronic components, fixing circuit boards, etc. 2. Automotive manufacturing: plays an important role in the adhesion and fixation of automotive interior and exterior components. 3. Industrial production: can be used for equipment protection, labeling, etc. 4. Medical field: used for fixing medical devices, dressings, etc. In summary, the die-cutting technology of 3M tape and its widespread application provide efficient and reliable bonding solutions for many industries.

With the continuous improvement of environmental awareness and the continuous progress of electric vehicle technology, the use of electric vehicles is increasing. As the core component of electric vehicles, the application scenarios of EV batteries are also constantly expanding. In addition to the f

With the continuous improvement of environmental awareness and the continuous progress of electric vehicle technology, the market prospects of electric vehicles are becoming increasingly broad. As the core component of electric vehicles, the market prospects of EV batteries are increasingly optimist

With the development of science and technology, the market has higher and higher requirements on the performance of UAV (Unmanned Aerial Vehicle), such as image transmission speed and clarity. However, as the volume of UAV should be as small as possible, it is increasingly difficult to design the cooling materials for its overall equipment.