The DSN SK12 series is an ultra-soft and highly conformable thermal conductive pad, which is recommended for application on low compression and low thermal resistance. It works stably at ambient temperature during -40~150 °C with meeting the requirement of UL94V-0 class. DSN SK12R is a high strength, high elasticity, high insulation, flame retardant, cost-effective of thermal interface material, for different applications, developed a number of models, which can meet the high compression and many heavy industries, tearing, high-frequency vibration impact and a wide variety of applications，especially suitable for automotive power battery pack. DSN SK12FG is a model of thermal conductive pad adopted with strengthened fiberglass based compound material, performing as higher tear resistance and puncture resistance, it also improves operability.
Product Description
Thermal Conductivity: 1.2W/m.k
Low Compression application
Low volatile performance (D3-D20)
Superior Temperature endurance
Excellent electrical isolation
Double side in natural inherent tack
NB/VGA
Area where heat needs to be transferred to a frame
RDRAM memory modules
Automobile engine control unit
FPD
Power conversion
LED lighting
Flat Panel Display(LCD、PDP、...)