Views: 403 Author: Site Editor Publish Time: 2024-07-15 Origin: Site
The heat dissipation materials used in flash storage devices include aluminum heat sinks, graphite heat dissipation sheet, thermal conductive silicone grease and high thermal conductivity silicone thermal pad.
Aluminum heat sink: This is a common heat dissipation material used in DDR memory flash storage devices, with various sizes and shapes such as 2510-100mm, 202016mm, 4040*5MM, etc., providing effective thermal solutions.
Graphite heat dissipation film: As a new type of thermal conductive material, graphite heat dissipation film has high thermal conductivity and flexibility, and is suitable for flash storage devices that require efficient heat dissipation. This material has excellent thermal conductivity and can effectively reduce the temperature during equipment operation.
Thermal conductive silicone grease: used to fill the small gaps between heat sinks and flash storage devices, improving heat dissipation efficiency. Thermal conductive silicone grease has good thermal conductivity and viscosity, which can ensure close contact between the radiator and the equipment, effectively dissipating heat.
High thermal conductivity silicone thermal pad: This pad usually has excellent thermal conductivity and a certain degree of elasticity, which can adapt to different heat dissipation needs and device shapes. Silicone gaskets usually have a slight stickiness on both sides, which can firmly adhere between the device and the heat sink, providing good heat dissipation effect.
These heat dissipation materials each have their own characteristics and are suitable for different types of flash storage devices. They improve the heat dissipation performance of the devices in different ways, ensuring stable operation even in high temperature environments.
