FAQ of thermal silicone pad
[ Date: 2019-05-25 00:00:00 Author: Popularity: ]
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The thermal conductive silicone pad is a heat conductive medium which is insulated and filled as an electronic product. It is a heat conductive material made of various kinds of auxiliary materials such as a thermal conductive powder, a flame retardant and a curing agent colorant added to the organic silica gel; the following is the heat conduction of Suzhou Dasen Electronic Material Co., Ltd. collected on the network about the problem of high thermal silicone pad:

Suzhou Dasen Electronics Material Co., Ltd is specialized in producing electronic materials development heat conduction heat insulating manufacturer, the main products: a thermally conductive silicone sheet, bond ply, silicon insulating tape, thermal grease, thermally conductive one-component glue, a thermally conductive potting gel, and the like.

1: thermal silicone pad and thermal grease, which is better?

A: thermal grease and thermal silicone pad have own advantages and disadvantages, if the distance in the chip is a bit bigger, thermal silicone pad is better. If the distance in the chip is small, thermal grease will be better. And have the more same situation. We need to choose products base on real request. 

2: What is the production process of thermal silicone pad?

A: Add thermal conductive powder, flame retardant and curing agent to the silicone oil, stir and mix the color, then vacuum to reduce the bubbles in the silica gel, then vulcanize at high temperature, cool down and cool, then carry out the rubber cutting and forming process; The project includes tests for parameters such as thermal conductivity, temperature resistance range, volume resistivity, withstand voltage, flame retardancy, tensile strength, hardness, and thickness.

3: What are the raw materials needed for the production of thermal silicone pads?

A: The main material is organic silica gel, by adding thermal conductive powder (metal oxide, metal nitride), curing agent, flame retardant, coloring agent and other accessories; if customers need to add other properties, such as back thermal adhesive for strong adhesive, backing rubber for high insulation performance.

4: Can thermal silicone pad use on the notebook CPU?

A: The CPU can use thermal silicone pad as a heat-conducting medium instead of thermal grease. However, considering the space structure and heat dissipation scheme inside the notebook, most of the current notebooks on the market use traditional silicone grease as the heat-conducting medium.

5: What is the thermal conductivity of the thermal silicone pad?

A: The thermal conductivity of the thermally conductive rubber sheet has SK/FSK 1.2W, 1.5W, 2W, 2.5W, 3W, 4W, 5W, 6W, 8W.

6: Is the thermal silicone pad leaking?

A: The silicone oil of the silicone sheet itself is insulated, and the added heat-conducting powder and auxiliary materials also have insulating properties, so there is no conductive leakage.

7: How long is the life of the thermal silicone pad?

Answer: The service life of the thermal silicone pad is generally more than ten years. The silicone sheet has low volatility, anti-aging, high and low-temperature resistance, and has shock absorbing and insulating effect, which can fully meet the service life of electronic products.

8: How to use thermal silicone pad?

A: Keep the contact surface between the heat dissipation surface and the heat source clean, tear off the release film attached to the thermally conductive silicone sheet, and fix it in the position of the heat conduction source, and press the heat sink to fix it. The following is the installation procedure for replacing the silicone plate on the computer motherboard. It is very convenient!

9: What is the price of thermal silicone pad?

A: The price of thermal silicone pad increases with the increase in thermal conductivity and thickness. It is recommended to use the thermal conductivity of the silicone sheet to meet the thermal conductivity of the electronic product. The thickness is controlled at 1.1 times the distance between the heat source and the heat sink.