ADVANTAGES OF NEW THERMAL CONDUCTIVE MATERIALS - THERMALLY CONDUCTIVE GEL

Before the introduction of thermal gels, thermal silicone pad is one of the commonly used materials in the heat dissipation and heat conduction market. It can be said that in the past many years, thermal silicone pad has solved a large number of heat conduction problems. The development of science and technology is changing with each passing day. The function of electronic products has been developing in an integrated way. The thermal circuit board is getting smaller and smaller, and the electronic components are more and more. The heat source of the circuit board is too concentrated, and the space between the heat sources is different, the shape is different, and the power of the electronic product is also increasing, so the requirements for the heat conductive material are getting higher and higher. More heat conductive sheet thermal silica cannot issue a thickness of the sheet meet. The thermal conductive silicone sheet requires a certain assembly pressure during the assembly process and inevitably generates certain stress on the circuit board. In the use scene requiring extremely low stress, the hardness of the thermally conductive sheet is as low as possible, but the hardness is extremely low. In the case of the thermal sheet, mucous membranes may occur, making the operation extremely difficult.

The thermal conductive gel independently developed by Suzhou Dasen Electronics Material Co., Ltd. is a gel-like new thermal conductive material made of silica gel composite thermal conductive filler, which is stirred, mixed and packaged. It adopts the dispensing design, which is used in the production of mixed nozzles, and can be automated, which is very convenient. The biggest advantage of the two-component thermal conductive gel compared to the thermally conductive silicone sheet is that the thermal conductive gel can be filled with various irregular shapes, and the assembly stress is extremely low, and the hardness after vulcanization is very low, and the expansion coefficient is small, in comparison, The thermal conductive gel is more diversified in formula design and can improve the stability of the circuit board. In terms of material utilization rate, the thermally conductive silicone sheet may have problems such as unqualified size and cutting edge material loss during the forming and cutting process, and the thermal conductive gel can accurately control the dispensing amount through the automatic dispensing machine, regardless of the material. The utilization rate is still convenient to use and the performance is stronger than the thermal pad

Two-component thermal gel