Intel promotes notebook cooling innovation
[ Date: 2020-01-06 11:34:20 Author: Popularity: ]
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According to foreign media reports, supply chain sources said that at the upcoming CES 2020, Intel plans to announce a new cooling module design, which will increase the cooling efficiency of notebook by 25% - 30% through the combination of Vapor chamber and graphite sheet, so as to gradually achieve the goal of wind free fan cooling of high-performance notebook.


According to DIGITIMES, Intel will launch the heat dissipation design of Vapor chamber + graphite sheet for the notebook of Athena project. The vapor chamber will replace the traditional heat pipe heat dissipation module with relatively concentrated heat dissipation, and further reduce the heat concentration by utilizing the large-area heat diffusion ability of the vapor chamber


The graphite sheet is placed at the back of the screen and uses the metal shell of the screen to dissipate heat, but the rotating shaft part needs to be redesigned so that the graphite sheet passes through the bottom shell so that the heat can be transmitted from the heat source chip to the graphite sheet and the screen shell.


With the new cooling design, suppliers will be able to gradually manufacture high-performance fanless laptops and further reduce the thickness of laptops.

                                                          Lenovo y9000x with four fans + VC cooling (figure from: Lenovo)


VC liquid cooling 


Vapor chamber, or VC for short, is usually a vacuum chamber with capillary structure on the inner wall. When the heat is transferred from the heat source to the VC, the liquid in the chamber will vaporize and absorb heat after being heated. When it contacts the cold end of the cooling fan, the gas will condense and release the previously absorbed heat.


 Compared with the traditional heat pipe cooling module solution, VC can be made into irregular large area shape, which can cover more widely on the hardware, increase the heat conduction area, and make the heat distribution more uniform.

        Lenovo y9000x VC heat dissipation module (figure from: Lenovo)

Intel Athena program 

At CES 2019 in Las Vegas, Intel officially announced the Athena plan, and announced the preliminary product planning and partners. The Athena project is a new initiative to launch the next generation of new ultra-thin laptops. In addition to better performance, Athena laptop must be able to immediately transfer from sleep to wake-up state, and have the ability to always keep the connection, have improved artificial intelligence function, support 5G connection, battery life can reach 20 hours, support touch screen control, etc. The Athena program is a set of standards that Intel, together with manufacturers such as HP, Dell and Lenovo, set for notebook computers.


It is said that Intel's vapor chamber + graphite sheet is part of its Project Athena certification program.