WHY USE THERMAL SILICON PAD AS THE THERMAL CONDUCTIVE MEDIUM?

As we all know, electronic products are developing in a smaller and smaller trend. Any electronic product is a heating body, which needs a complete set of heat dissipation solutions. At present, the most important material for these electronic products in the heat conduction medium——Silicone thermal pad, whose performance has been constantly improving to meet the increasingly high requirements of heat dissipation.

At present, the thermal conductivity of the thermal conductive silicon film on the market can be 0.8w-8.0w. Compared with the previous years, the thermal conductivity of the thermal conductive silicon film can be more than 3W, which has raised a big step. The thermal conductivity of the thermal conductive silicon film can reach 0.05-k.㎡/W. The hardness can also be adjusted according to the actual situation of the customer's products. In general, the thickness of the range of 10-50 degrees can be as thick as 15mm. In this case, the thermal conductivity is generally relatively low. In general, the thickness of the thermal conductivity of the ultra-high thermal conductivity silica gel sheet is not more than 5mm.

Thermal conductive silicon film has the following advantages:

1. The thermal conductivity of the thermal silicone film is highly selective and very stable. Customers can choose the appropriate thermal conductive silicone film according to their actual product needs, which is in line with the product needs without unnecessary waste. Compared with the thermal conductivity of the thermal conductive double-sided adhesive, the thermal conductivity of the thermal conductive double-sided adhesive in the current market is not more than 1W, and the applicability is relatively poor So strong.

2. The thickness and hardness of the thermal conductive silicon film can be adjusted according to the actual needs of the product. Therefore, in the thermal conductive channel, the size difference of the heat dissipation structure and the chip can be bridged, and the difference of the contact surface of the radiator in the structural design can be reduced. The thermal conductive silicon film can fully increase the contact area between the heat generator and the heat dissipation device, and can greatly reduce the production cost.

3. Thermal conductive silicon film has not only thermal conductivity, but also insulation performance, which has excellent protective effect on EMC. Because the material is silicone sheet, it is not easy to be pierced and torn or damaged under pressure. EMC has good reliability.

4. Thermal conductive silicon film has good elasticity and compressibility, and has good shock absorption effect. Adjusting density and soft hardness can produce a good absorption effect on low-frequency electromagnetic noise.