Views: 0 Author: Site Editor Publish Time: 2020-06-09 Origin: Site
1. PS5 uses liquid metal TIM
Sony released an official teardown video, showing the internal structure of the new next-generation game console PlayStation 5. After two years of consideration and verification, the Sony ps5 team adopted liquid metal thermal interface material (TIM) on the ps5 to transfer the huge heat generated by the main processor (SOC) to the radiator, so as to speed up the heat dissipation of the equipment and ensure the long-term reliable operation of the ps5 under high performance conditions.
2. Huawei Mate40 series 3D graphene
Both Mate40Pro and Mate40Pro+ use 3D graphene heat dissipation film for heat dissipation. The so-called 3D is a z-direction stacking design based on the original single-layer processing technology, which can match the whole machine architecture space, stack flexibly, and realize leapfrog heat dissipation.
3. Redmi k30pro's first medium frame / stainless steel vapor chamber integration
K30pro is positioned as the pioneer of 5g flagship image with strong performance. It launched the 3435mm2 super large area stainless steel VC liquid cooled vapor chamber. The key heat sources are covered with graphene and multi-layer graphite film, creating a three-dimensional heat dissipation system and escorting the whole fire of snapdragon 865.
4. Intel launches vapor chamber+ graphite sheet notebook cooling innovation
Intel plans to announce a new heat dissipation module design that will increase the heat dissipation efficiency of notebooks by 25%-30% through the combination of vapor chamber + graphite sheets, thereby gradually achieving the goal of fanless heat dissipation for high-performance notebooks. According to DigiTimes, Intel will launch a vapor chamber + graphite sheet heat dissipation design for Athena notebooks. The vapor chamber will replace the traditional heat pipe heat dissipation module with relatively concentrated heat dissipation, and use the large area heat diffusion capacity of the vapor chamber to further reduce heat concentration.
5. A new generation of matebook X: vapor chamber heat conduction and shaft heat dissipation
Huawei MateBook X adopts a fanless design, using a combination of ultra-thin vapor chamber (VC) and a heat-conducting shaft to guide heat to the screen shell, and use a large-area metal shell to enhance natural heat dissipation efficiency. The crowded internal layout of thin and light notebooks squeezed the space and heat dissipation efficiency of the cooling fan. On MateBook X, Huawei abandoned the fan active cooling module. Instead, through the combination of ultra-large area and ultra-thin VC and heat conduction shaft, a large number of the heat of the notebook computer chip is directed to the screen shell that will not be touched during work, reducing the heat conduction on the keyboard surface, and improving the user experience while mute.
6. DJI mavic air 2 UAV remote control
Remote control is important equipment for UAV to send and receive control commands. In this series of actions, it is bound to produce a lot of heat. If the heat dissipation is not timely, the command execution is slow, and even affects the service life. DJI Mavic Air 2 drone remote control is different from the previous Mavic remote control "down clamp" mobile phone, this model is changed to "up clamp" type, it should be more habitual in viewing the image transmission angle and operation; a special point that It is a separate antenna which is not exposed, and the control module of the top cover uses a thermal pad. The bottom of the drone shell is metal heat dissipation net, which is conducive to air convection. There are huge aluminum fins on the metal cooling net; increasing the heat dissipation area is equal to enhancing the heat dissipation efficiency. There is a lot of blue thermal conductive silicone grease between the aluminum radiator and the main board of the remote control. The main board and the heat sink first quickly transfer heat through thermal grease, and the heat reaches the heat sink, and then uses air convection to dissipate heat. The control modules on both sides of the top cover of the remote controller are filled with thermal conductive gaskets to the gaps between the components in the bottom shell, so as to realize the functions of heat dissipation and buffering.
7. Translator
The metal body is used as the heat dissipation shell, and the battery is close to the shell for rapid heat dissipation, the gray thermal silica gel pad makes the heat of the motherboard conduct to the metal shell more efficiently.
8. Canon EOS R5 internal cooling and external tilta active cooling accessories
The thickness of the aluminum heat sink is 0.98mm, and the bottom of the CPU also has a heat dissipation pad, which means that Canon directs the heat of the four SDRAM chips around the CPU to one heat sink and directs the heat of the CPU itself to another area.
There are many parts inside the Canon EOS R5 camera, which have been completely filled, and the iron head TILTA photographic equipment kit will launch an active heat dissipation housing system package specially designed for Canon EOS R5 SLR cameras, allowing users to use the camera with peace of mind when shooting, don’t worry about overheating.
9. Soymilk machine thermostat
Because most of the soymilk machines are controlled by microcomputer intelligent temperature controller, the process of preheating, beating, boiling and delayed cooking is fully automated. Especially, due to the addition of "slow cooking" processing program, the soymilk is more nutritious and tastes more fragrant. According to the temperature change of the working environment, the temperature controller will have physical deformation inside the switch, which will produce some special effects, such as a series of automatic control elements that produce on or off action. Therefore, in the design and manufacture of the soymilk machine, in order to automate the preheating, beating, boiling and delayed boiling, the temperature controller must use thermally conductive silicone grease to accurately control heat dissipation and heat generation.
10. The photovoltaic inverter adopts full glue filling for heat dissipation
The appearance of the inverter is made of alloy metal shells at the front and back, which is conducive to heat dissipation from the inside of the PCB board, and the whole is also sturdy and durable. The black thermal conductive silica gel is used inside (the silica gel is relatively soft, which is conducive to repair). The components such as flyback inverter which are easy to generate heat are directly connected with the shell with thermal conductive adhesive, so as to avoid the heat spreading to the PCB. In this way, other components are prevented from being interfered by the heat, resulting in changes in the electrical characteristics of the components.
11. Graphics card
CPU uses thermal conductive silicone grease and thermal silicone pad to cover inductive components.
12. Etc industrial computer
The automatic ticket gate machine has no fan cooling system, working temperature -10~60℃, storage temperature -20~60℃, 0%~90% relative humidity, non-condensing, ensuring 7*24 hours of uninterrupted shutdown of the machine. The shell is made of high thermal conductivity metal, and the internal core CPU uses the thermal interface material as the heat transfer medium to keep the heat transfer and heat dissipation channels smooth.
13. LED explosion-proof lights
Some special explosion-proof places (such as underground coal mines) use aluminum alloy shells for heat dissipation, In the power frequency withstand voltage test of explosion-proof luminaires, the 2 kV power frequency withstand voltage of the AC input to the shell or ground, in addition to the need to use isolation topology on the drive circuit, the necessary electrical insulation is generally required through the filling thermal conductive material between the aluminum substrate and the housing, In this case, in addition to high thermal conductivity, the thermal conductive material must also have high insulation resistance (> 20 m Ω) to meet the technical requirements.
