What Is A Graphene Thermal Pad with A Thermal Conductivity Greater Than 30W?

Graphene thermal pad bases on graphene materials with high-quality properties such as low density, high thermal conductivity, and high compressibility, a graphene thermal pad with anti powder coating is prepared using edge wrapping or adhesive film coating technology. As a thermal interface material, it can effectively replace thermal conductive silicone pads, thermal conductive silicone grease, etc., providing excellent heat dissipation solutions for power semiconductors, consumer electronics, etc.

1) High thermal conductivity, capable of exceeding 300W/(m · K) in the transverse direction and up to 30W/(m · K) in the longitudinal direction, with excellent heat and thermal conductivity;

2) Good joint filling performance, compression rate can exceed 60%;

3) High safety, eliminating oil and pump issues, using insulation edge wrapping technology, ensuring safe and stable operation throughout the entire lifecycle;

4) Flexible thickness, adjustable thickness ranging from 50-1000 microns, convenient for filling joints of various sizes, and larger thickness can be stacked to achieve;

5) Efficient grounding can be achieved, with a conductivity of 10 to the power of 5.

The following figure shows a typical scenario of power semiconductor heat dissipation. The heat from the IGBT module is directly transferred to the outer shell of the heat sink through TIM, and then carried away by forced convection through air cooling or liquid cooling. High performance graphene foam has excellent thermal conductivity and is highly stable and reliable, ensuring worry free operation of equipment in various harsh environments.