Views: 120 Author: Site Editor Publish Time: 2017-01-17 Origin: Site
Common points of VC liquid cooling and heat pipe
The inner wall of the VC liquid-cooled heat-dissipating heat-equalizing plate is a layer of capillary structure, and the interior is filled with liquid and evacuated. When heat is released, the internal liquid vaporizes and is transferred to the condensation layer where it is cooled and condensed into water. From this point of view, the heat pipe and VC seem to be the same thing.
Differences of VC liquid cooling and heat pipe
Different from the heat pipe, the VC product is first evacuated and then filled with pure water in order to fill all the microstructures. The filling medium does not use methanol, alcohol, acetone, etc., but uses deaerated pure water, which can improve the efficiency and durability of the Vapor Chamber.
The combination of the VC soaking plate and the heat pipe is basically the same in principle and theoretical structure, but the differences are: dimensions, manufacturing methods, vacuuming and water injection procedures. The soaking plate actually has the advantages of low extended thermal resistance, uniform heat flux, rapid heat diffusion, and light weight.
Cost
Heat pipe cooling technology is relatively mature and the price is relatively low. The Vapor Chamber dissipates heat faster, but the cost is relatively high, and it is generally used on electronic products that are smaller and require faster heat dissipation.
| Ultra thin heat pipe (HP) | Ultra thin VC | |
Advantages | 1. Mature process and high yield | 1. Two dimensional heat conduction, high heat conduction efficiency, higher heat dissipation and temperature equalization effect than heat pipe | |
2. Low manufacturing cost and unit price | |||
2. The shape can be customized according to the product structure of the customer, which can help the customer to solve the effect of heat dissipation and uniform temperature to the greatest extent | |||
3. Not limited by the size of raw materials, it can be designed and produced completely according to the size of the heat source of the guest, without the assistance of other auxiliary parts, so as to reduce the cost of the guest | |||
4. Stable reliability --- The product is edge-sealed by diffusion welding, the internal support column and capillary structure are welded, the strength is strong, and the aging life test temperature is above 140 ° C. | |||
5. The hardness and strength of ultra-thin VC with alloy copper are higher than that of ultra-thin heat pipe, which is not easy to deform | |||
Disadvantages | 1. One-dimensional thermal conduction method, low thermal conduction rate (low efficiency), low heat dissipation power | 1. Process cost and material (alloy copper) cost are higher than ultra-thin heat pipe | |
2. Although the shape can be bent, the radian of the angle cannot be bent or the performance is weakened, which affects the practicality of the product ranch |
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3.Can't customize specific heterosexual heat pipe according to customer product outline structure | |||
4. Affected by the width of the copper tube, it cannot be fully contacted with the customer's heat source (CPU / GPU). We need to weld or bond the copper sheet to increase the cost of the customer | |||
5. The material is generally pure copper. The material is soft and volatile. Compared with VC, it has a shorter life and a greater risk of performance degradation. | |||