Thermal solution for electronic products - Smart phone
[ Date: 2021-11-26 14:33:06 Author: Popularity: ]
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The dominant frequency of smart phone chips is getting higher and higher, which will produce a lot of heat. Too much heat is not only made negative impact on customer comfort while using smart phone but also burn out the hardware. Therefore, major smart phone magnates always consider the smart phone heat dissipation issue as a very crucial agenda.

After 2019, driven by the demand for mobile phones in the future, mobile phone heat dissipation has once again become a new hot spot in the market. For example, Xiaomi's game mobile phone, black shark mobile phone, is equipped with a multilevel direct contact integrated hot and cold heat dissipation system. The main heat dissipation part is copper, and only the slender part in the middle has a very small amount of built-in liquid; In addition, glory note10 adopts the nine hot and cold heat dissipation technology, adds a liquid cooling heat dissipation layer on the basis of the original eight layer heat dissipation, and adopts heat conduction graphite sheet and heat pipe; In addition, Meizu 16 also adopts water cooling and heat dissipation, and thermal conductive silicone grease is coated on the surface of the processor to further improve the thermal conductivity! With the advent of 5G era, mobile phone heat dissipation has become a hot spot in the industry. When the battery capacity of smart phones cannot be greatly improved, in addition to developing schemes to reduce energy consumption, heat dissipation is more important for smart phones. In addition, at present, the glass back cover will become the mainstream of the market, and its heat dissipation performance is worse than that of metal back cover, This is also an important reason why many glass back cover mobile phones use graphite sheets on the glass back cover! According to market news, Huawei 5G mobile phone is expected to use 0.4mm copper sheet and apply thermal conductive silicone grease to fill the gap as the core heat dissipation component of the mobile phone!


The 5G mobile phone antenna and RF front-end will change greatly. The high-frequency mobile phone antenna is still expected to adopt the active mode, and the power consumption of the mobile phone will increase significantly. The heat dissipation technical scheme will be very important. In addition to the traditional graphite heat dissipation and liquid-cooled heat pipe heat dissipation technology, new heat dissipation technologies will be born in the future, including some new heat dissipation materials will also be applied in smart phones.


With the increasing application of heat dissipation components in mobile phones and PCs, many enterprises have laid out the field of heat dissipation components and materials. With the advent of the era of 5G + Internet of things, the intelligence of mobile phones and people's dependence on mobile phones will be different in the future. As the direction of smart phone research and development, the application of heat dissipation technology in smart phones will become more and more important. The heat dissipation demand of mobile phone industry will also drive the change of heat dissipation materials and the research of new technologies, More and more enterprises will carry out layout or industrial upgrading in this field.