Summary
The surface of thermal silica pad is flat and smooth, and has good adhesion to the surface of various metal and ceramic base materials. With high thermal conductivity, it can achieve low thermal resistance under relatively low pressure.
Characteristic
High thermal conductivity, low thermal resistance
High AC voltage value
Smooth surface
Strong pressure resistance, wear resistance
Non-sticky surface
Application
Communication equipment, network terminal,
Storage equipment, security equipment,
Consumer electronics, automotive electronics,
LED lighting, household appliances,
New energy, aerospace industry
PROPERTIES | UNITS | SK800 | SK1500 | SK2500 | SK3500 | TEST METHOD |
Color | / | Gray | Dark red | Yellow | White | Visual |
Thermal impedance 1mm@50psi | ℃in2/W | 0.8 | 0.7 | 0.35 | 0.23mm-0.28 0.38mm-0.32 | ASTM D5470 |
Specific Gravity | g/cm3 | 2.5 | 2.5 | 2.5 | 2.5 | ASTM D792 |
Volume Resistivity | ΩCM | 1012 | 1012 | 1012 | 1011 | ASTM D257 |
Thermal Conductivity | W/mk | 0.8 | 1.5 | 1.5 | 5 | ASTM D5470 |
Withstand Voltage | KV@1mm | 6 | 6 | 6 | 6 | ASTM D149 |
Thickness (±10%) | mm | 0.3 | 0.2 | 0.15/0.2/0.3 | 0.23/0.38/0.5 | ASTM D374 |
Hardness | Shore 00 | 80 | 80 | 80 | 90 | ASTM D2240 |
Flammability class | UL94-V0 | UL94-V0 | UL94-V0 | UL94-V0 | UL94 | |
Application temperature | ℃ | -40~+200 | -40~+200 | -40~+150 | -40~+150 | *** |
Tape Choose | / | ∨ | ∨ | ∨ | ∨ | *** |
Self-adhesive | / | -- | -- | -- | -- | *** |
Fiber Strengthen | / | ∨ | ∨ | PI film | fiberglass | *** |