The surface of thermal silica sil pad is flat and smooth.
It has good adhesion to the surface metal and ceramic base materials.
With high thermal conductivity, it can achieve low thermal resistance under relatively low pressure.
Characteristic
High thermal conductivity, low thermal resistance
High AC voltage value
Smooth surface
Strong pressure resistance, wear resistance
Non-sticky surface
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Product Description
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
| PROPERTIES | UNITS | DSN SK800 | DSN SK1500 | DSN SK2500 | TEST METHOD |
| Color | / | Gray | Dark red | Yellow | Visual |
| Thermal impedance 1mm@20psi | ℃in2/W | 0.8 | 0.7 | 0.3 | ASTM D5470 |
| Specific gravity | g/cm3 | 2.5 | 2.5 | 2.5 | ASTM D792 |
| Volume resistivity | ΩCM | 1012 | 1012 | 1012 | ASTM D257 |
| Thermal conductivity | W/mk | 0.8 | 1.5 | 1.5 | ASTM D5470 |
| Withstand voltage | KV@1mm | 6 | 6 | 6 | ASTM D149 |
| Thickness (±10%) | mm | 0.23 | 0.19/0.23 | 0.15/0.2/0.3 | ASTM D374 |
| Hardness | Shore 00 | 80 | 80 | 80 | ASTM D2240 |
| Flammability class | UL94-V@2mm | UL94-V0 | UL94-V0 | UL94-V0 | UL94 |
| Working temperature | ℃ | -40~+200 | -40~+200 | -60~+180 | *** |
| Tape choose | / | ∨ | ∨ | ∨ | *** |
| Self-adhesive | / | -- | -- | -- | *** |
| Fiber strengthen | / | ∨ | ∨ | PI film | *** |
