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THERMAL PAD WITH PI FILM

DSN SKI series thermal gap pads are high efficiency pads with polyimide film designed for heat dissipation of new energy automotive batteries. They are new generation products with high thermal conductivity and low thermal resistance. It has good tensile property, high deformation elasticity and good compression ratio. It uses special toughness structure to increase operability and durability. No break or deformation after punching, stripping or deformity design.

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Product Description

Product Description

 

PROPERTIES UNITS DSN SK15I DSN SK20I TEST  METHOD
Color / White gray Light gray Visual
Thermal impedance @1mm/20Psi ℃in2/W 0.58 0.50 ASTM D5470
Specific gravity g/cm3 2.2 2.5 ASTM D792
Volume resistivity ΩCM 1014 1014 ASTM D257
Thermal conductivity W/mk 1.5 2.0 ASTM D5470
Withstand voltage KV/mm ≧12 ≧12 ASTM D149
Thickness (±10%) mm 0.3~5.0 0.3~5.0 ASTM D374
Hardness Shore 00 50 50 ASTM D2240
Tensile strength Mpa 0.65 0.65 ASTM D412
Elongation % 180 180 ASTM D412
Compression ratio@10Psi % 5 5 ASTM D575
Compression ratio@50Psi % 35 35 ASTM D575
Compression ratio@100Psi % 50 50 ASTM D575
Flammability class / UL94-V0 UL94-V0 UL94
Working temperature -50~+200 -50~+200 ***

 

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