16 kinds of heat dissipation methods for semiconductor and the importance of thermal design for electronic equipment

Nowadays, there are more and more kinds of electronic products around us. When we choose, we will not only compare their functions, but also consider the appearance. The current development trend of electronic products is thin and light weight. Therefore, there will be a challenge, that is, the internal space of electronic products is becoming more

The square cell of the electric vehicles can be inserted into these small spaces like a computer hard disk. The side of each cell is also pasted with thermal conductive silicone pad, and the heat sink along the width direction of the cell has a heat dissipation channel, which can be directly connected with the external cooling pipeline.

In 2021, Jiangxi Dasen Technology Co., Ltd. broke through the technical problem of ultra thick PI sintering and produced thick graphite sheet with excellent performance. The thickness of single layer graphite sheet is as high as 100um.

At present, different brands of mobile phone application of heat dissipation technology is not the same, in order to make the heat dissipation performance stronger, some mobile phones use the combination of these cooling technology, complementary advantages. In short, the cooling system is an indispensable technology in the mobile phone experience.