Polyimide (PI) film is known as the "golden film" and is a key insulation material in fields such as electronics, electronics, space, etc. High performance PI film, after high-temperature carbonization and graphitization treatment, can be made into graphite heat sinks with a thermal conductivity several times that of copper, which is the core material for solving heat dissipation problems in electronic products. With the upgrade of communication technology from 4G to 5G, the introduction of high frequency, continuous improvement of hardware integration, and continuous miniaturization of chips, the heat generation of devices has increased dramatically, and heat dissipation has become a bottleneck problem faced by 5G terminals.
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