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INSTRUCTION MANUAL FOR THIN SILICONE THERMAL PAD - THICKNESS LESS THAN 0.5MM

Views: 1125     Author: Site Editor     Publish Time: 2022-03-21      Origin: Site

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Instructions of using thin thermal silicone pad

1. Generally, the thermal pad is protected with release film, and the silicone pad is slightly sticky.

Before operation, the hands should be cleaned and dried to prevent sweat, dust and other impurities from sticking to the thermal pad, which will affect the self-adhesion and sealing thermal conductivity of the pad.

 2. After taking the pad out of the carton, the stacking height of products should be no more than 20cm.

Products should be stacked in order to avoid extrusion deformation.

3. Place the front side of the product (the side marked with lines) on the table top with an oblique angle. One corner of the product protrudes from the table top. The left hand holds the sheet material to fix the product. The right hand gently and parallelly peels off the protective film from the corner of the thermal pad to avoid uneven stress, causing deformation of the silicon pad and affecting the subsequent operation.

 

4. It is not allowed to tear off the protective films on both sides at the same time, so as to reduce the frequency and area of direct contact with the silicon pad, so as to avoid the deformation of the pad and maintain the original characteristics of the pad. 

                                                    

 

 

5. Align the front side of the silica pad with one end of the heat dissipation part. The other end is suspended at a slight angle with the product, and then the thermal pad is put down. The speed is not easy to be too fast to       avoid bubbles. Tear off the protective film at the bottom of the silicone product to complete the bonding.

6. If there are bubbles in the operation, pull up one end of the silicon pad and put it gently, or use a ruler to gently drive away the bubbles. The force should not be large, so as to avoid moving the pad or scratching the pad.

7. Breaking, twisting, pinching and other destructive actions should be avoided in the bonding process. If the force is too large, the silicone pad is easily damaged.

8.  After laminating, apply some pressure evenly to the heat dissipation parts and products by hand, so that the fit is more firm.

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