The thermal conductive silicone pad is an electronic heat conductive medium material mainly used for filling the gap between the IC chip and the heat sink or the outer casing for heat transfer. It has good adhesion, electrical insulation properties, compression properties, and excellent thermal conductivity. In the industry, it is also called therm

The thermal conductive silicone pad is a heat conductive medium which is insulated and filled as an electronic product. It is a heat conductive material made of various kinds of auxiliary materials such as a thermal conductive powder, a flame retardant and a curing agent colorant added to the organic silica gel; the following is the heat conduction

Compared with the traditional heat pipe cooling module solution, VC can be made into irregular large area shape, which can cover more widely on the hardware, increase the heat conduction area, and make the heat distribution more uniform.

Thermal graphite sheet has excellent physical characteristics, and has become the best choice of heat dissipation material for electronic products.

Q: Why use the thermal interface material (TIM)? A: The use of a thermally conductive material eliminates the air gap between the two contact surfaces by the integration of the rough and uneven mating surfaces. Since the thermal conductivity of the material is much greater than the air it will replace, the resistance through the joint is reduce