Continuous upgrading of heat dissipation technology schemes, the market scale in 5G era is expected to exceed 200 billion yuan Thermal design and thermal management are the core components of electronic products. There are many downstream applications of heat dissipation, including consumer electronics, automobiles,

Speaking of 5G heat dissipation, we have to mention smartphones. 5G phone chips will consume 2.5 times the power of current 4G modems, and more power consumption means 5G phones will use more sophisticated and advanced technology to control overheating. It is known that Qualcomm's 5G chip consumes 5.3w of power. If both lens and 3D sensing operatio

VC liquid cooling (vacuum chamber soaking plate technology, English name vapor chamber) is also known as the soaking plate, uniform temperature plate etc., which is an efficient way to transfer heat.

New 5G iPhone is likely to use graphite sheet design, and Huawei will also reduce its demand for vapor chamber by 50% in 2020. In other words, the demand of 5G mobile phones for vapor chamber in 2020 will be much lower than expected.

The battery diaphragm is mainly to separate the positive and negative plates of the battery in a narrow space to prevent the short circuit caused by the contact between the two poles, but it can ensure the free passage of ions in the electrolyte between the positive and negative poles.