In the era of 1G and 2G before the popularity of smart phones, mobile phones were less troubled by heat dissipation technology. But with the coming of the 3G intelligent machine, the hardware configuration of mobile phones is getting higher and higher. CPU has been upgrading to multi-core and high performance. The communication rate has been rising
The thermal conductive silicone pad is an electronic heat conductive medium material mainly used for filling the gap between the IC chip and the heat sink or the outer casing for heat transfer. It has good adhesion, electrical insulation properties, compression properties, and excellent thermal conductivity. In the industry, it is also called therm
The thermal conductive silicone pad is a heat conductive medium which is insulated and filled as an electronic product. It is a heat conductive material made of various kinds of auxiliary materials such as a thermal conductive powder, a flame retardant and a curing agent colorant added to the organic silica gel; the following is the heat conduction
Compared with the traditional heat pipe cooling module solution, VC can be made into irregular large area shape, which can cover more widely on the hardware, increase the heat conduction area, and make the heat distribution more uniform.
