The continuous improvement of electronic product performance has brought about heat dissipation problems. 

Phase change materials have the characteristics of efficient heat dissipation, good temperature stability, and adaptability to the trend of miniaturization, providing efficient heat dissipation solutions for electronic products. In computer chips, mobile phones and other devices, heat sinks or heat dissipation gel made of phase changing materials can quickly absorb and disperse heat. When the temperature of the device increases, the phase change material undergoes a phase transition, absorbing a large amount of heat and avoiding performance degradation and hardware damage caused by overheating. Taking a well-known mobile phone brand as an example, after adopting phase change material heat dissipation technology, the temperature of the phone during high load operation was reduced by 10-15 ℃, effectively improving the user experience.

A Japanese electronic device manufacturer used phase change material heat dissipation modules in a high-performance laptop. This module is located near the CPU and GPU of the computer. When the computer runs under high load for a long time and the chip temperature rises, the phase change material quickly undergoes a phase transition, absorbing a large amount of heat and controlling the chip temperature within a safe range, avoiding performance degradation and crashes caused by overheating. Compared with traditional heat dissipation methods, the use of phase-change material heat dissipation modules has reduced the average CPU temperature of laptops by 12 degrees Celsius during high load operation, significantly improving the performance and stability of the computer.

DASEN currently has phase change materials with thermal conductivity up to 6W/mK, and the specific parameters are as follows. 

We hope to help you solve the product's heat dissipation problem.