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DSN SK20 2.0W/mK Thermal Pad for Mobile Phone

DSN SK20 thermally conductive rubber pad is composed of silicone polymer and ceramic fillers. It is fabricated via special process with high Cost/Performance value. It is double side self-tacky. Under low contact pressure, it can demonstrate excellent thermal transfer and electric isolation. Under 40~150℃, it performs stably and accords with UL94V0.

DSN SK20R is a high strength, high elasticity, high insulation, flame retardant, cost-effective of thermal interface material, for different applications, developed a number of models, which can meet the high compression and many heavy industries, tearing, high-frequency vibration impact and a wide variety of applications.

DSN SK20FG is a model of thermal conductive pad adopted with strengthened fiberglass based compound material, performing as higher tear resistance and puncture resistance, it also improves operability.

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Product Description

Product Description

Features:

  • Thermal Conductivity: 2.0W/m.k

  • Low Compression application

  • Easy in assembly and reusable

  • Superior Temperature endurance

  • Excellent electrical isolation

  • Double side in natural inherent tack

Applications:

  • PC cooling modules

  • Area where heat needs to be transferred to a frame

  • Flat Panel Display (LCD/PDP/...)

  • LED lighting

  • Power conversion

  • Automobile engine control unit

  • RDRAM memory modules

  • FPD

  • Network communication equipment

  • Power modules


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