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DSN SK50

DSN SK50 thermal conductive pad is composed of silicone polymer and ceramic fillers.It is fabricated via special workman ship with high Cost/Performance value. It is double side self-tacky. Under low contact pressure, it can demonstrate excellent thermal transfer and electric isolation. Under -40~150℃, it performs stably and accords with UL94V0.

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Product Description

Product Description

Features:

  • Thermal conductivity: 5.0W/mK

  • Low thermal resistance at very lowpressures

  • High electrically isolative

  • Superior Temperature endurance

  • Conformable,lowhardness

  • Double side self-tacky

  • High electrically isolative

  • Superior Temperature endurance

Applications:

  • PC/NB

  • VGA

  • Network communication equipment

  • LCD back-lightmodule

  • H.D.D&DVD

  • DRAM modules

  • High thermal conductivity module

  • Automobile engine control unit


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