Thermal pad is a kind of thermal conductive functional composite material with certain thermal conductivity and flexibility. It is mainly used to fill the gap between semiconductor device and radiator, so as to improve the transfer efficiency of excess heat generated by semiconductor device in work.
The performance requirements of mobile phones are getting higher and higher, and there are many kinds of materials needed. Please see the detailed material introduction
In order to further enhance the fire safety awareness of all employees, improve everyone's self-prevention and self-help skills, and prevent fire accidents, our company organized a fire drill on June 19.