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2021
DATE
06 - 30
ADVANTAGES AND DISADVANTAGES OF THERMAL SILICON PAD
Thermal pad is a kind of thermal conductive functional composite material with certain thermal conductivity and flexibility. It is mainly used to fill the gap between semiconductor device and radiator, so as to improve the transfer efficiency of excess heat generated by semiconductor device in work.
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2021
DATE
06 - 24
DESIGN SERVICES AND QUALITY ASSURANCE OF HEAT SINK
Design services and quality assurance of heat sink, vapor chamber, heat pipe and radiator - Dasen
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2021
DATE
06 - 24
FUNCTIONAL MATERIALS FOR SMART PHONE SOLUTION
The performance requirements of mobile phones are getting higher and higher, and there are many kinds of materials needed. Please see the detailed material introduction
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2021
DATE
06 - 23
INSTRUCTION MANUAL FOR THERMAL PAD WITH FIBER
Brief intronduction of how to use the thermal pad with fiber
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2021
DATE
06 - 22
FIRE DRILL
In order to further enhance the fire safety awareness of all employees, improve everyone's self-prevention and self-help skills, and prevent fire accidents, our company organized a fire drill on June 19.
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