Products

Thermal Gel

Silicone thermal gel (one component)
The single component precuring heat conducting gel is applied to all kinds of components with low stress requirement to make the products have high reliability. The product is self-adhesive and easily assembled. Meanwhile, customers can automatically dispense glue according to their own process to improve production efficiency.

Product Description

Silicone thermal gel with graphene (one component)

 

                                  

 

Parameters of one component thermal gel

PROPERTIES

Unit

HM400

HM500HF

HM700

HM900

TEST METHOD

Color

/

Green

     Blue   

Gray

    Red      

Visual

Min interface thickness

mm

0.1

0.1

0.1

0.12

-

Density

g/cc

2.9

3.2

3.3

3.5

ASTM D792

Specific heat capacity

J/g·K

1.1

1.1

1.1

1.1

ASTM E1269

Extrusion rate

g/min

25

40

15

15

30cc tube, 0.130” needle, 90psi (621 kPa)

Volatility

%

<0.01

<0.01

<0.01

<0.01

ASTM E595

Volume Resistivity

ΩCM

1013

1013

1013

1013

ASTM D257

Thermal Conductivity

W/mK

4.0

5.0

7.0

9.0

ASTM D5470

Breakdown Voltage

KV/mm

≥6.0

≥6.0

≥6.0

≥6.0

ASTM D149

Flammability class

/

UL94-VO

UL94-VO

UL94-VO

UL94-VO

UL94

Application temperature

-50~+200

-50~+200

-50~+200

-50~+200

-

 

Features of thermal gel:
* Low interface resistance
* Low stress, low modulus
* Aging resistance, temperature resistance
* Stable chemic and mechanical property
* Super insulating property
* No settling, store at room temperature

Applications of thermal gel (one component)
* Smart Phone, Tablet computer
* Communication equipment
* Power module
* High power LED
* Military Equipment
* Power Semiconductor

 

 

 

2.Silicone thermal gel with graphene (two components)


The two-component silicon-based liquid thermal gap filling material contains reinforced graphene. It has good thixotropy and low viscosity after mixing in 1:1 ratio. When subjected to the external forces, it can be easily filled into the surface of the heat-generating device and the surrounding gap to form heat thermal film bridge with the heat sink when subjected.
After curing at room temperature or accelerated curing at high temperature, the thermal gel has a good elastic modulus. It helps to relieve the stress released by the thermal expansion of the heating device due to heat generation, protects the components from damage, and is easy to peel off on the device, facilitating customer rework. At the same time, customers can achieve automated dispensing according to their own processes to improve production efficiency.

Parameters of two components thermal gel

 

PROPERTIES

Unit

HF200

HF350

HF600

TEST METHOD

Color

/

Yellow/white

Blue/white

Gray/white

Visual

Density

g/cc

2.5

3.2

3.3

ASTM D792

Viscosity

g/min

280,000

300,000

270,000

ASTM D2196

Hardness after curing

shore 00

45

55

65

ASTM D2240

Volatility

%

<0.01

<0.01

<0.01

ASTM E595

Volume Resistivity

ΩCM

1013

1013

1013

ASTM D257

Thermal Conductivity

W/mK

2.0

3.5

6.0

ASTM D5470

Breakdown Voltage

KV/mm

>5.0

>5.0

>5.0

ASTM D149

Flammability class

/

UL94-VO

UL94-VO

UL94-VO

UL94

Application temperature

-50~+200

-50~+200

-50~+200

-

Operation time@ 25℃

min

60

300

120

-

Curing temperature@ 25℃

Hrs

6

24

10

-

Curing temperature@ 120℃

min

10

20

20

-

 

Features of thermal gel with graphene:
* Low interface resistance
* Low stress, low modulus
* Aging resistance, temperature resistance
* Stable chemic and mechanical property
* Super insulating property
* No settling, store at room temperature

Applications of graphene thermal gel (two components)
* Power Semiconductor
* Automotive electronic modules
* New energy battery pack
* Intelligent terminals, mobile phones, tablets
* Communications equipment
* Power supply module
* High power LED
* Military equipment
* Power semiconductor