Silicone thermal gel (one component)
The single component precuring heat conducting gel is applied to all kinds of components with low stress requirement to make the products have high reliability. The product is self-adhesive and easily assembled. Meanwhile, customers can automatically dispense glue according to their own process to improve production efficiency.
Product Description
1. Silicone thermal gel (one component)
Parameters of one component thermal gel
PROPERTIES | Unit | HM400 | HM500HF | HM700 | HM900 | TEST METHOD |
Color | / | Green | Blue | Gray | Red | Visual |
Min interface thickness | mm | 0.1 | 0.1 | 0.1 | 0.12 | - |
Density | g/cc | 2.9 | 3.2 | 3.3 | 3.5 | ASTM D792 |
Specific heat capacity | J/g·K | 1.1 | 1.1 | 1.1 | 1.1 | ASTM E1269 |
Extrusion rate | g/min | 25 | 40 | 15 | 15 | 30cc tube, 0.130” needle, 90psi (621 kPa) |
Volatility | % | <0.01 | <0.01 | <0.01 | <0.01 | ASTM E595 |
Volume Resistivity | ΩCM | 1013 | 1013 | 1013 | 1013 | ASTM D257 |
Thermal Conductivity | W/mK | 4.0 | 5.0 | 7.0 | 9.0 | ASTM D5470 |
Breakdown Voltage | KV/mm | ≥6.0 | ≥6.0 | ≥6.0 | ≥6.0 | ASTM D149 |
Flammability class | / | UL94-V0 | UL94-V0 | UL94-V0 | UL94-V0 | UL94 |
Application temperature | ℃ | -50~+200 | -50~+200 | -50~+200 | -50~+200 | - |
Features of thermal gel:
* Low interface resistance
* Low stress, low modulus
* Aging resistance, temperature resistance
* Stable chemic and mechanical property
* Super insulating property
* No settling, store at room temperature
Applications of thermal gel (one component)
* Smart Phone, Tablet computer
* Communication equipment
* Power module
* High power LED
* Military Equipment
* Power Semiconductor
2. Silicone thermal gel (two components)
The two-component silicon-based liquid thermal gap filling material contains reinforced graphene. It has good thixotropy and low viscosity after mixing in 1:1 ratio. When subjected to the external forces, it can be easily filled into the surface of the heat-generating device and the surrounding gap to form heat thermal film bridge with the heat sink when subjected.
After curing at room temperature or accelerated curing at high temperature, the thermal gel has a good elastic modulus. It helps to relieve the stress released by the thermal expansion of the heating device due to heat generation, protects the components from damage, and is easy to peel off on the device, facilitating customer rework. At the same time, customers can achieve automated dispensing according to their own processes to improve production efficiency.
Parameters of two components thermal gel
PROPERTIES | Unit | HF200 | HF350 | HF600 | TEST METHOD |
Color | / | Yellow/white | Blue/white | Gray/white | Visual |
Density | g/cc | 2.5 | 3.2 | 3.3 | ASTM D792 |
Viscosity | g/min | 280,000 | 300,000 | 270,000 | ASTM D2196 |
Hardness after curing | shore 00 | 45 | 55 | 65 | ASTM D2240 |
Volatility | % | <0.01 | <0.01 | <0.01 | ASTM E595 |
Volume Resistivity | ΩCM | 1013 | 1013 | 1013 | ASTM D257 |
Thermal Conductivity | W/mK | 2.0 | 3.5 | 6.0 | ASTM D5470 |
Breakdown Voltage | KV/mm | >5.0 | >5.0 | >5.0 | ASTM D149 |
Flammability class | / | UL94-V0 | UL94-V0 | UL94-V0 | UL94 |
Application temperature | ℃ | -50~+200 | -50~+200 | -50~+200 | - |
Operation time@ 25℃ | min | 60 | 300 | 120 | - |
Curing temperature@ 25℃ | Hrs | 6 | 24 | 10 | - |
Curing temperature@ 120℃ | min | 10 | 20 | 20 | - |
Features of thermal gel:
* Low interface resistance
* Low stress, low modulus
* Aging resistance, temperature resistance
* Stable chemic and mechanical property
* Super insulating property
* No settling, store at room temperature
Applications of thermal gel (two components)
* Power Semiconductor
* Automotive electronic modules
* New energy battery pack
* Intelligent terminals, mobile phones, tablets
* Communications equipment
* Power supply module
* High power LED
* Military equipment
* Power semiconductor