You are here: Home / News / Technology News / 16 KINDS OF HEAT DISSIPATION METHODS FOR SEMICONDUCTOR (2)

16 KINDS OF HEAT DISSIPATION METHODS FOR SEMICONDUCTOR (2)

Views: 0     Author: Site Editor     Publish Time: 2022-03-05      Origin: Site

facebook sharing button
twitter sharing button
line sharing button
wechat sharing button
linkedin sharing button
pinterest sharing button
whatsapp sharing button
sharethis sharing button

Electronic products currently on the market thermally conductive material commonly used are: silicone thermal pad, thermal grease, thermally conductive double-sided tape, and a phase change material and so on.

The following is a simple analysis of the advantages and disadvantages of these kinds of thermal materials and the main application environment.

1: silicone thermal pad

Advantages: good caulking property, large thickness adjustable range, strong tolerance performance, good insulation, large compression, certain anti-shock effect, slightly viscous on both sides, and strong operability.

Disadvantages: The manufacturing process below 0.5mm is complicated, the thermal resistance is relatively high, and the cost is relatively high.

Main application environment: between the heating component and the housing under the condition that the gap between the heating component and the heat sink is large.

2: thermal grease (thermal grease)

Advantages: semi-liquid state, relatively high thermal conductivity, can be applied very thin, good caulking, resulting in lower thermal resistance and lower cost

Disadvantages: the thickness of the application should not be too thick, preferably less than 0.2mm. It is not suitable for large-area application. It is inconvenient to operate. After long-term use, it will age easily under high temperature and will dry out. The thermal resistance will increase volatility.

Main application environment: between high-power heating components and heat sinks, heat-dissipating components have their own fixtures

3: thermal double-sided tape

Advantages: low thickness, generally below 0.3mm, strong adhesive, can be used to fix small radiators.

Disadvantages: thickness cannot be too thick, cannot be used when the gap is large, cannot be reused, thermal conductivity is not high.

Main application environment: between the low-power heat source and the small heat sink, used to fix the heat sink

4: phase change materials

Advantages: At room temperature, it is in the form of flakes, thin in thickness, and strong in maneuverability. Under high temperature conditions, the phase changes into a semi-liquid state, and the caulking property is strong, and there is an instantaneous heat absorption capability in the phase change process.

Disadvantages: not easy to store, transport, relatively high cost.

Main application environment: on the thermal module

GET IN TOUCH

  No.888, Guangming Road, High-tech Zone, Xinyu, Jiangxi, China
  +86-512-6638 9461
  +86-138 6217 7522

PRODUCT LINKS

QUICK LINKS

Copyright © 2023 Jiangxi Dasen Technology Co., Ltd.