New Heat Dissipation Ways in 5G Era
[ Date: 2019-08-30 17:24:04 Author: Popularity: ]
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Three Basic Ways of thermal transmission

1. Heat conduction
2. Convection
3. Radiation


In the process of thermal transmission, according to the different structure of radiator, heat transfer will be carried out by means of heat conduction, convection and radiation.

The principle of heat dissipation of electronic products is to take heat from heat-producing devices to radiators through thermal conductive interface materials, and eventually to dissipate heat to the external environment, to reduce the temperature of electronic products.

Focusing on the new heat dissipation mode in 5G era has always been the pain and difficulty of consumer electronics industry. Thermal conductive materials are mainly used to solve the thermal management problems of electronic equipment. The heat generated in operation will directly affect the performance and reliability of electronic products. Thermal conductive materials are mainly used between the thermal interfaces of the system. By filling the rough and uneven bonded surfaces, the thermal interface materials with thermal conductivity much higher than that of air are used to replace the non-heat-transfer air, so as to reduce the thermal resistance through the thermal interface and improve the heat dissipation efficiency of semiconductor components. The industry is also known as "thermal interface materials". In the past, the heat dissipation of consumer electronic products mainly used the high thermal conductivity of copper and aluminum materials to directly dissipate heat, or combined with silica gel, fans and fluid to form a heat dissipation system to take away the heat emitted by devices.


With the advent of the smart age, people's demand for mobile phones is getting higher and higher, and the hardware configuration of mobile phones is also improving. CPU from single-core to dual-core is gradually upgrading to four-core and eight-core, and screen size and resolution are also increasing. With the improvement of hardware and performance of mobile phones, the problem of cell phone fever is becoming more and more serious. If the heat cannot be released in time, it will face the problems of cell phone burning, carton, crash or even explosion. At present, the heat dissipation technology used in mobile phones mainly includes graphite heat dissipation, metal backplane, boundary heat dissipation, heat conduction gel heat dissipation, heat pipe heat dissipation, vapor chamber and so on.