DSN SK25 thermally conductive rubber pad is composed of silicone polymer and ceramic fillers. It is fabricated via special work process with high Cost Performance value. It is double side self-tacky. Under low contact pressure, it can demonstrate excellent thermal transfer and electric isolation.Under 40~150℃, it performs stably and accords with UL94V0.
DSN SK25FG is a model of thermal conductive pad adopted with strengthened fiberglass based compound material, performing as higher tear resistance and puncture resistance, it also improves operability.
Product Description
Thermal conductivity: 2.5W/mK
Lowthermalresistanceatverylowpressures
Easy in assembly and reusable
Superior Temperature endurance
Doublesideself-tacky
Conformable,lowhardness
PC/NB
Processors to heatsinks
Power conversion
HDDVD dirver IC
Automotive engine/trans mission controls
GPU VRAM
GPU to heatsinks
Mass Storage Drives
LCD back-light module
Network communication equipment