Products

DSN3250

DSN3250 thermally conductive rubber pad is composed of siliconepolymer and ceramic fillers. It is fabricated via special workprocess with high Cost Performance value. It is double side self-tacky. Under low contact pressure,it can demonstrate excellentthermal transfer and electric isolation.Under40~150℃,it performsstably and accords with UL94V0.
DSN3250FG is a model of thermal conductive pad adopted withstrengthened fiberglass based compound material, performing ashigher tear resistance and puncture resistance, it also improvesoperability.

Product Description

Features

  • Thermal conductivity: 2.5W/mK
  • Lowthermalresistanceatverylowpressures
  • Easy in assembly and reusable
  • Superior Temperature endurance
  • Doublesideself-tacky
  • Conformable,lowhardness

Applications:

  • PC/NB
  • Processors to heatsinks
  • Power conversion
  • HDDVD dirver IC
  • Automotive engine/trans mission controls
  • GPU VRAM
  • GPU to heatsinks
  • Mass Storage Drives
  • LCD back-light module
  • Network communication equipment