Heat conducting silicone pad is a heat conducting medium material synthesized by various processes with silica gel as the base material and heat conducting filler. It is specially used to fill the air gap between heating devices and heat sink or metal base. It has good flexibility, so that it can be used to cover very uneven surfaces, so as to transfer heat and protect components.
Characteristic:
• low thermal resistance;
• high plasticity;
• high electrical insulation;
• high compression ratio;
Application:
• power module;
• security products;
• intelligent terminal products;
• Netcom products;
Application cases of thermal conductive silicon pad:
